Challenges in the Thermal Management of Microprocessors


R. V. Mahajan


In this paper, the evolution of microprocessor power and the impact
on thermal management is traced.  It is shown that thermal management is
rapidly becoming one of the key challenges in microprocessor packaging.  The
evolution of thermal solutions and the impact of technical and business
constraints is traced.  It is shown that cooling of microprocessors involves
technical, integration and business challenges.  Current strategies and some
future needs are traced.  A case is made for the need to address thermal
management along a number of fronts including device, package and system
innovations.  Some of the future areas of focus are discussed to stimulate
thought among the technical community.


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